DesignCon 2026

Conference at a Glance

DesignCon 2026 is the premier high‑speed communications and system design conference and expo, returning to the Santa Clara Convention Center from February 24–26, 2026. It focuses on the toughest challenges in chip, board, and systems design, with a deep emphasis on high‑speed digital design, signal integrity, and power integrity.

If you work on high‑speed links, power delivery networks, advanced packaging, or system‑level signal integrity, DesignCon 2026 is designed to be a valuable learning and networking weeks of the year.

Conference Program

DesignCon’s conference is built “by engineers for engineers,” with an expert technical program committee curating sessions each year. In 2026, the program spans 15 tracks, combining deep technical rigor with practical application for real‑world hardware.​

Core Technical Focus Areas

According to the program overview and event partners, you can expect strong coverage in these areas:

• Signal & Power Integrity at Higher Speeds
  Modeling and mitigating crosstalk, reflections, power rail noise, and EMI as data rates climb in multi‑gigabit serial links and dense PCBs.

• High‑Speed Link Design & Interconnects
  Architecting and validating links for data center, networking, and high‑performance computing systems, including channels, connectors, and cables.

• System Architecture & Co‑Design
  How chip, package, and board decisions interact; methodologies for chip–package–board co‑optimization and end‑to‑end performance.

• AI‑Enabled and Automated Design Tools
  Use of machine learning and advanced EDA flows to accelerate design space exploration, modeling, and verification.

• Test, Measurement, and Validation
  Practical approaches to characterizing high‑speed channels, validating compliance to standards, and building robust lab setups.

Application Domains and Themes

The official education overview highlights cross‑cutting themes such as automotive, autonomous systems, consumer electronics, IoT, and medical—threads that appear across multiple tracks and sessions. For example:​

• Automotive & autonomous: in‑vehicle high‑speed networks, sensor links, and EMC challenges

• IoT & consumer: low‑power high‑speed interfaces, dense wireless environments

• Medical: reliability and signal integrity in safety‑critical devices
  

Across these topics, sessions range from foundational talks for newer engineers to highly specialized deep dives for experienced SI/PI experts.​

The Expo: Tools, Demos, and Free Education

Alongside the conference, DesignCon 2026 hosts a large expo hall featuring hundreds of exhibitors—major test and measurement vendors, EDA companies, component manufacturers, connectors and cables specialists, and more.

What You’ll Find on the Expo Floor

• Live demos of high‑speed test setups
  Oscilloscopes, VNAs, BERTs, and compliance test benches for emerging standards.

• EDA and simulation solutions
  Channel modeling, EM and SI/PI simulation, power integrity analysis, and system‑level co‑simulation.​

• Connectors, cables, and interconnect technology
  Solutions optimized for higher bandwidth, lower loss, and better manufacturability.​

• Advanced packaging and materials
  Substrates, packages, and interposers for 3D/2.5D and high‑density designs.

Many vendors use DesignCon to debut or highlight new tools and product generations, making it a useful place to compare solutions side by side.

Chiphead Theater and Free Sessions

Even if you are on an expo‑only pass, you still have access to free educational sessions:

• Presentations in the Chiphead Theater, often focused on emerging standards, AI/ML in design, and new interconnect technologies

• Exhibitor‑led technical talks and mini‑tutorials

• Live demos that walk through real measurement setups or design flows

These sessions are especially useful if you want concentrated learning without a full conference pass, or if you need to keep up with trends while managing a packed meeting schedule.

Awards and Community: Engineer of the Year

DesignCon also emphasizes professional recognition and community building through its Engineer of the Year award.​

Each year, a single engineer is recognized for:

• Leadership in chip, board, or system‑level design

• Creativity and “out‑of‑the‑box” thinking

• Impact on signal and power integrity practices in particular​

The award helps highlight real‑world practitioners whose work moves the industry forward. For attendees, it provides role models and case studies of how deep technical expertise translates into influence and career growth.

Who Should Attend DesignCon 2026 (and Why)

Because DesignCon is so focused on high‑speed design and system‑level challenges, different roles will find different types of value.

Signal & Power Integrity Engineers

• Deep technical sessions on channel modeling, PDN design, and simulation

• Direct conversations with tool vendors and peers solving similar problems

• Exposure to the latest measurement techniques and reference designs

Board and Hardware Designers

• Practical guidance on routing strategies, stack‑ups, and materials at higher data rates

• Insights on co‑design with packaging and mechanical constraints

• Examples of how teams are balancing performance, cost, and manufacturability

System Architects & Technical Leads

• System‑level views of future interconnects, standards, and architectures

• Benchmarks for what leading teams are doing in data centers, automotive, and edge systems

• Strategic perspective on which tools and methodologies are becoming “must‑have”

Test & Validation Engineers

• Detailed looks at compliance testing, fixture design, and measurement uncertainty

• Live lab‑style demos in exhibitor booths and theater sessions

• Opportunities to compare test setups and automation approaches with peers

Students and Early‑Career Engineers

• Exposure to advanced topics in a structured, track‑based environment

• Networking with experienced engineers, hiring managers, and vendors

• A fast way to see where the field is heading and what skills are in demand

How to Get the Most Out of DesignCon 2026

DesignCon can be intense given the. multiple parallel tracks, a large expo, and meetings all competing for your time. A bit of planning will dramatically increase your return on travel and registration costs.

1. Define your focus upfront

Before you land in Santa Clara, decide:

• Which tracks matter most (e.g., SI/PI, high‑speed links, AI/EDA tools)

• 3–5 questions you want answered (e.g., “How are others validating PCIe at this speed?”)

• Which tools or vendors you absolutely need to meet on the expo floor

Use the official conference agenda (once published) to block key sessions on your calendar.

2. Balance deep dives and discovery

Aim for a mix of:

• Deep technical sessions directly aligned with your current work

• A few exploratory talks in adjacent areas (e.g., AI‑enabled design tools, automotive SI), to keep an eye on where the field is moving

This balance helps you bring home immediately applicable tactics as well as strategic insight.

3. Use the expo as a working lab

Treat the expo as a chance to:

• Walk through concrete measurement setups and ask how vendors handle edge cases

• Compare simulation and EDA workflows side by side

• Collect reference designs, app notes, and demo project files you can review later

Arrive with a shortlist of booths you must visit, then leave time to wander and discover unexpected solutions.

4. Prioritize networking

Many attendees find the most lasting value in the hallway conversations and informal discussions:

• Introduce yourself after sessions that hit close to your current challenges

• Use social events and breaks to meet peers in similar industries

• Follow up quickly on interesting conversations with LinkedIn or email while you’re still on site

Over time, DesignCon can become a central node in your professional network as you see the same community of engineers year after year.

Practical Value and Next Steps

• Registration: Expo admission is free for qualified attendees who register online in advance; conference passes are available at additional cost.​

For the latest agenda, pricing, and travel details, always refer to the official DesignCon website and FAQs, as schedules and policies can evolve as the event approaches.